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提出了一种新型热感功耗模型,该模型能够准确估计出电压调整情况下的功耗和温度.实验结果表明如果忽略热效应,泄漏功耗将会被低估最高达52%.使用电压调整技术对电路的能量消耗和温度进行协同优化时,两者具有不一致的优化方向.温度是未来集成电路发展的一个重要限制因素,而温度优化方法可以降低电路温度最高达12℃,同时其能耗的增长低于最优解的1.8%.
A new model of thermal power dissipation is proposed, which can accurately estimate the power consumption and temperature under voltage regulation. The experimental results show that if the thermal effect is neglected, the leakage power consumption will be underestimated up to 52% .Using the voltage regulation technique When the energy consumption and the temperature of the circuit are optimized, the two have an inconsistent direction of optimization.Temperature is an important limiting factor in the future development of integrated circuits, and the temperature optimization method can reduce the circuit temperature up to 12 ℃, while its energy consumption Growth is below 1.8% of the optimal solution.