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本文介绍了等离子增强磁控溅射沉积技术。有关技术背景、技术发展、技术应用都作了论述。对技术关键问题进行了评论 ,并得出几点结论
This article describes plasma enhanced magnetron sputtering deposition technology. The technical background, technology development, technology applications are discussed. Comment on the key technical issues and draw some conclusions