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采用光纤激光以振镜扫描的方式对四方扁平封装(QFP)器件进行了焊接实验研究,得到了激光钎焊参数配合SnAg3.0Cu0.5钎料的焊点抗拉强度的变化规律。基于振镜扫描的激光钎焊(11W,20mm/s或8W,10mm/s)不仅能够获得力学性能优良的无铅焊点,而且焊接速度大大提高。通过比较连续光纤激光钎焊、脉冲光纤激光钎焊和红外再流焊SnAg3.0Cu0.5钎料焊点的抗拉强度,表明连续光纤激光钎焊能明显地提高焊点的力学性能。同时对比研究了两种钎料SnAg3.0Cu0.5和Sn63Pb37在连续光纤激光焊的抗拉强度,表明SnAg3.0Cu0.5焊点的力学性能更加突出。焊点的拉伸断面显微形貌显示为塑性断裂,焊缝金相组织细密,界面过度平缓,生成了金属间化合物Cu6Sn5。
The welding experiment of quad flat package (QFP) was conducted by means of galvanometer laser with scanning galvanometer. The variation of the tensile strength of solder joints with laser brazing parameters in combination with SnAg3.0Cu0.5 solder was obtained. Laser brazing based on galvanometer scanning (11W, 20mm / s or 8W, 10mm / s) can not only obtain lead-free solder joints with excellent mechanical properties, but also greatly improve the welding speed. By comparing the tensile strength of continuous fiber laser welding, pulsed fiber laser welding and infrared reflow soldering SnAg3.0Cu0.5 solder joints, it shows that continuous fiber laser welding can significantly improve the mechanical properties of the solder joints. At the same time, the tensile strengths of two kinds of solders, SnAg3.0Cu0.5 and Sn63Pb37, in continuous fiber laser welding were compared. The results show that the mechanical properties of SnAg3.0Cu0.5 solder joints are more prominent. Tensile fracture surface microstructure of the weld showed a plastic fracture, microstructure of the weld microstructure, the interface is too gentle, resulting in an intermetallic compound Cu6Sn5.