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采用电弧离子镀的方法,通过改变脉冲偏压幅值在M2高速钢表面制备了TiN/TiAlN多层薄膜,研究了脉冲电压幅值TiN/TiAlN多层薄膜微观结构和性能的变化。随着脉冲偏压幅值的增加,薄膜表面的大颗粒数目明显减少。EDX结果表明,脉冲偏压幅值的增加还引起Al/Ti原子比的降低。TiN/TiAlN多层薄膜主要以(111)晶面为择优取向生长,随着脉冲偏压幅值的增加,峰值强度逐渐增强,晶粒尺寸在8 nm～14 nm。制备的TiN/TiAlN多层薄膜的硬度都超过36 GPa,是M2高速钢基体硬度的3.9倍以上,膜基结合力均达到60 N以上。摩擦磨损测试结果表明,TiN/TiAlN多层薄膜具有良好的抗磨损性能。
The TiN / TiAlN multilayered films were prepared on the surface of M2 high speed steel by changing the pulse bias amplitude by arc ion plating. The microstructure and properties of TiN / TiAlN multilayered films with different pulse voltage amplitudes were studied. As the pulse bias amplitude increases, the number of large particles on the surface of the film is significantly reduced. The EDX results show that the increase of pulse bias voltage also causes a decrease in the Al / Ti atomic ratio. The TiN / TiAlN multilayered film mainly grows with the (111) crystal plane as the preferential orientation. With the increase of pulse bias voltage, the peak intensity gradually increases and the grain size ranges from 8 nm to 14 nm. The prepared TiN / TiAlN multilayer films all have hardness over 36 GPa, which is 3.9 times higher than that of M2 high speed steel substrate and the bonding strength of film base is over 60 N. Friction and wear test results show that, TiN / TiAlN multilayer film has good wear resistance.