本文研究了废镀金电子元件的细菌脱镀,在20-35℃的温度下,经过约两天的处理,可将约97%的金镀层剥离下来.脱镀后,金呈碎片状留于溶液中,而废元件大都保持其原来状态,极易与溶液分离.文中讨论了脱镀速度、脱镀机理、脱镀液中 Fe~(2+)离子的浓度及脱镀后液的细菌再生问题.此法的主要优点是工艺简单、操作条件较好和不用昂贵的化学试剂. In this paper, bacterial de-plating of waste gold-plated electronic components was studied, and about 97% of the gold coating was peeled off after about two days of treatment at a temperature of 20-35 ° C. After depolarization, the gold remained in the form of fragments in the solution , While most of the spent components keep their original state and can be easily separated from the solution.This paper discusses the speed of delamination, the mechanism of depolarization, the concentration of Fe ~ (2+) ions in the deplating solution and the bacteria regeneration problem The main advantages of this method are simple process, good operating conditions and no expensive chemical reagents.