绪言随着产品小型化,高密度实装基板、微细间距部品、多层基板开发的急速发展,伴随着锡丝的无铅化,锡焊接自身就变得更困难了,因此必须重新研究焊接方法。在SM T再流焊的附加焊接工程及局部焊接的领域,微细化程度高且多种多样的手工的与机器人的无铅的锡焊接技术的确立也成了当 Introduction With the rapid development of miniaturization, high-density mounted substrates, fine pitch parts and multi-layer substrates, soldering itself becomes more difficult due to the lead-free solder wire. Therefore, it is necessary to re-study the soldering method . In the field of additional soldering and partial soldering of SM T reflow soldering, the establishment of a miniaturization and a variety of lead-free soldering technologies for hand and robot has also become a