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采用高速压制成形-冷锻-渗铜的方法制备了W-10Cu复合材料,并探讨了W粉粒度及样品单重对材料组织与性能的影响。结果表明:冷锻前后W骨架的相对密度均随W粉样品单重的增加而降低;压制后混合粉W骨架的相对密度最大,但仍未达到W-10Cu复合材料对W骨架相对密度不小于81%的要求;经冷锻后,三种粒度W骨架的相对密度的最大值均达到81%,其中,中粒度粉W骨架的相对密度最大;三种粒度的W粉均可通过高速压制成形-冷锻-渗铜的方法制备出组织均匀致密、满足电子封装材料性能要求的W-10Cu复合材料。
W-10Cu composites were prepared by high-speed press-forming, cold forging and infiltration of copper. The effects of W particle size and sample weight on the microstructure and properties were also discussed. The results showed that the relative density of the W skeleton before and after cold forging decreases with the increase of the single weight of the W powder sample. The relative density of the W powder skeleton after pressing is the largest but the relative density of the W skeleton is not less than W-10Cu 81% of the requirements; after cold forging, the maximum relative density of W skeleton of the three particle sizes reached 81%, of which, the relative density of the medium-sized powder W skeleton maximum; three kinds of particle size W powder can be high-speed press forming - cold forging - copper infiltration method to prepare uniform and dense tissue to meet the performance requirements of electronic packaging material W-10Cu composite material.