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为了研究荧光粉发热对大功率LED器件热特性的影响,设计了五种不同荧光粉涂敷方式的大功率LED器件,利用ANSYS软件建立热力学模型进行仿真。将模拟与实测结果进行比较,结果表明,铝基板底部的实测温度、透镜顶部的实测温度、芯片的计算结温与加荧光粉热载荷的模拟温度更相近,不加荧光粉热载荷条件下的模拟温度要低于加荧光粉热载荷的模拟温度和实测温度,并且荧光粉涂敷的量以及涂敷的方式对芯片结温、铝基板底部温度、透镜顶部温度都有影响。
In order to study the effect of phosphor heating on the thermal characteristics of high power LED devices, five high power LED devices with different phosphor coating designs were designed. The thermodynamic model was simulated by ANSYS software. The simulation and measured results are compared. The results show that the measured temperature at the bottom of the aluminum substrate, the measured temperature at the top of the lens and the calculated junction temperature of the chip are more similar to those simulated with the heat load of the phosphor powder. The simulated temperature is lower than the simulated temperature and the measured temperature of the phosphor’s thermal load, and the amount of phosphor coating and the manner of application have an effect on the chip junction temperature, the temperature at the bottom of the aluminum substrate, and the temperature at the top of the lens.