论文部分内容阅读
单晶锗属于硬脆性光学半导体材料,加工时易产生裂纹和凹坑等缺陷,严重影响其表面质量.为了达到纳米级的表面质量,本文采用分子动力学模拟从不同晶面和晶向对单晶锗进行纳米压痕分析,在纳米尺度下对其进行压痕加载和卸载,分析该过程中载荷的变化情况,得到弹性模量的变化差异.结果表明,加载前后弹性模量差异小的单晶锗(111)晶面可以作为实际生产中的加工面,从而获得高质量的加工表面.
Single crystal germanium belongs to the hard and brittle optical semiconductor material, it is easy to produce defects such as cracks and pits when processing, which seriously affect the surface quality.In order to achieve the nano-scale surface quality, molecular dynamics simulation is used to simulate the single- The results show that the difference of the elastic modulus is obtained when the germanium is indentation loading and unloading at the nanoscale, and the change of the load in the process is analyzed. The crystalline germanium (111) crystal face can be used as the processing face in practical production, so as to obtain a high-quality processed surface.