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美国Ametek公司,特种金属制品分公司发明了一种适于电器行业用铜-钼复合材料的生产方法。这种复合材料的特点在于:在一种连续Cu基体内夹带有大量的离散钼粒子。钼粒子的粒径比介于1:1～4:1不等,这就便于在复合材料的第一、二面基体内形成温度通道。由于其钼粒子是限制在上述规定范围内,所以,这种复合材料具有良好的穿厚导热性。这种复合带材材的加工方法是:钼粉与氧化氩铜搅拌混合,混合粉料加热至生成涂铜态钼粉粒后再和铜粉搅拌混合,最后再经轧制辗压成复合带材。对钼含量超过80%的混合粉料则不需再经二次搅拌混合过程。
American Ametek company, special metal products branch invented a suitable for the electrical industry with copper - molybdenum composite production methods. This composite material is characterized by: a continuous Cu matrix entrained with a large number of discrete particles of molybdenum. The particle size ratio of molybdenum particles ranged from 1: 1 to 4: 1, which facilitated the formation of temperature channels in the first and second matrix of the composite. Because of its molybdenum particles is limited within the above-specified range, so the composite material has good through-thickness thermal conductivity. The processing method of the composite belt material is that the molybdenum powder and the argon oxide copper are stirred and mixed, the mixed powder is heated to generate the copper-coated molybdenum powder and then is mixed and stirred with the copper powder, and finally is rolled and rolled into the composite belt material. Mixture of molybdenum content of more than 80% do not need to be mixed by the second mixing process.