利用键参数函数理论分析了第三组元Bi或Sn作为Al-Pb非混溶体系实现冶金结合一体化的可行性,并采用液-固包覆成型的方法制得了Al-Bi-Pb及Al-Sn-Pb层状复合材料,通过SEM、EDS等检测手段分析研究试样的显微组织,并讨论了界面的扩散现象。结果表明:第三组元Bi或Sn的引入将Al、Pb的混合焓ΔHmin降低到零以下,在扩散动力学作用驱使下使各元素间在界面处发生了迁移和互扩散,形成了成分调控区,表现为一条状的均质固溶体带,实现了Al与Pb之间的冶金结合。 The key element function theory is used to analyze the feasibility of combining the third elemental Bi or Sn as the Al-Pb immiscible system to achieve metallurgical integration. Al-Bi-Pb and Al are prepared by liquid-solid overmolding -Sn-Pb layered composites. The microstructure of the samples was analyzed by SEM, EDS and other testing methods. The interface diffusion phenomenon was also discussed. The results show that the introduction of the third element, Bi or Sn, reduces the mixing enthalpy, ΔHmin, of Al and Pb below zero. Driven by the diffusion kinetics, the elements migrate and interdiffuse at the interface, forming a compositional regulation Region, showing a strip of homogeneous solid solution with the realization of the metallurgical bond between Al and Pb.