论文部分内容阅读
利用小型流化床实验台对机械制备的Cu基载氧体在4个反应温度(650℃、750℃、850℃和950℃)和两种气氛(CH4和CO+H2)下进行了实验研究,结果表明:两种气氛下Cu基载氧体的还原转化率并不随温度的升高而单调递增,而是有个最佳反应温度,分别为750℃和850℃;由于CH4气氛下Cu基载氧体表面的积碳比CO+H2气氛下严重,因此4个温度下Cu基载氧体的还原转化率都比CO+H2气氛下低,这也说明CO+H2比CH4更适合Cu基载氧体的化学链燃烧。为了避免因积碳而带来的载氧体失活,在管式炉内进行CO和载氧体的燃烧反应时,向炉内通入水蒸气,结果发现Cu基载氧体表面的积碳得到有效抑制。
The Cu-based oxygen carrier prepared mechanically was tested on a small fluidized bed test bed at four reaction temperatures (650 ℃, 750 ℃, 850 ℃ and 950 ℃) and two atmospheres (CH4 and CO + H2) The results show that the reduction conversion of Cu-based oxygen carrier does not increase monotonically with the increase of temperature under both atmospheres, but has the best reaction temperature of 750 ℃ and 850 ℃, respectively. Due to the reduction of Cu-based Therefore, the reduction conversion of Cu-based oxygen carrier at 4 temperatures is lower than that of CO + H2 gas, which indicates that CO + H2 is more suitable than CH4 for Cu-based Carrier oxygen chemical chain combustion. In order to avoid deactivation of the oxygen carrier due to carbon deposition, steam was introduced into the furnace in the combustion reaction of CO and oxygen carrier in a tube furnace. As a result, it was found that carbon deposition on the surface of the Cu-based oxygen carrier Effective inhibition.