论文部分内容阅读
采用预制件制备,压力浸渗金属工艺制备Diamond/Cu复合材料,分析了Cu基体合金化及金刚石颗粒表面金属化情况下,Cr元素对复合材料界面结构和热性能的影响。结果表明,Diamond/Cu-Cr复合材料中金刚石与Cu-Cr合金界面结合良好,Cr元素在界面处发生富集并与金刚石反应生成Cr3C2,其界面结构为金刚石-Cr3C2-富Cr的Cu-Cr合金层-Cu-Cr基体,复合材料的热导率达到520W.m-.1K-1;Diamond-Cr/Cu复合材料中金刚石表面金属化Cr层在熔渗过程中与Cu互扩散,促进界面结合,形成金刚石-Cr3C2层-纯Cr层-Cu-Cr互扩散层-Cu的界面结构。与Diamond/Cu-Cr复合材料相比界面处增加了Cr层,材料的热导率仅为279W.m-1.K-1,但均高于Diamond/Cu复合材料的热导率。
Diamond / Cu composites were prepared by preform preparation and pressure impregnation metal process. The effects of Cr element on the interfacial structure and thermal properties of the composites were analyzed under the alloying of Cu matrix and the surface metallization of diamond particles. The results show that the interface between diamond and Cu-Cr alloy is well bonded in the Diamond / Cu-Cr composite. The Cr element enriches at the interface and reacts with diamond to form Cr3C2. The interface structure is diamond-Cr3C2- Cr-rich Cr-Cr Cu-Cr matrix, the thermal conductivity of the composites reached 520W.m-1K-1; the Cr layer on the diamond surface of Diamond-Cr / Cu composites interpenetrated with Cu during infiltration, promoted the interface Combined to form an interfacial structure of the diamond-Cr3C2 layer-pure Cr layer-Cu-Cr interdiffusion layer-Cu. Compared with Diamond / Cu-Cr composites, Cr layer is added at the interface, the thermal conductivity of the material is only 279W.m-1.K-1, but both are higher than the thermal conductivity of Diamond / Cu composites.