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利用显微红外热成像技术对功率器件进行热可靠性分析。先从理论上阐述了显微红外热成像技术的原理,进而尝试利用该技术进行微波功率器件可靠性筛选工作,通过分析获取了显微红外图像中的温度分布和峰值温度,大大提高了器件可靠性筛选工作的准确性。在功率器件失效分析方面,利用显微红外热成像技术对发生失效的器件进行热成像和分析,通过定位失效点找到器件发生失效的原因。另外,还利用该技术来验证器件热设计的成功与否,通过显微红外热成像获取的温度信息如峰值温度、温度分布等来判断器件的热设计是否符合要求,在实际的器件设计过程中起到了良好的效果。
Thermal Reliability Analysis of Power Devices Using Microscopic Infrared Thermography. Firstly, the theory of microscopic infrared thermography was expounded theoretically, and then the reliability screening of microwave power devices was attempted. The temperature distribution and the peak temperature in the microscopic infrared image were obtained by analysis, which greatly improved the reliability of the device Sex Screening Job Accuracy. In power device failure analysis, thermal imaging and analysis of the failed devices are performed by using microscopic infrared thermography. The failure of the device can be found by locating the failure point. In addition, this technology is also used to verify the success of the thermal design of the device. The temperature information obtained from the microscopic infrared thermal imaging such as peak temperature and temperature distribution can be used to determine whether the thermal design of the device meets the requirements. In the actual device design process Played a good effect.