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为了使温度循环试验在有效提高电子组件的可靠性方面得以广泛应用,基于温度循环试验的机理,对电子组件温度循环试验的关键参数(温度范围、循环次数、保持时间、温变速率、风速)进行了探讨,给出了这些参数的工程经验选取值。在此基础上,借助热分析软件分析了温变速率、保持时间和风速三个参数对试验过程的影响并定性分析了三个参数间的关系。最后,提出了进行温度循环试验时应注意的问题,强调科学、正确地执行温度循环试验的重要性。
In order to make the temperature cycling test widely used in improving the reliability of electronic components, based on the mechanism of temperature cycling test, the key parameters (temperature range, number of cycles, holding time, temperature change rate and wind speed) Discussed, given these parameters engineering experience selected value. On this basis, the influence of the three parameters of temperature change rate, holding time and wind speed on the test process was analyzed by means of thermal analysis software and the relationship between the three parameters was qualitatively analyzed. Finally, the problems that should be paid attention to when carrying out the temperature cycle test are put forward, emphasizing the importance of scientific and correct execution of the temperature cycle test.