论文部分内容阅读
本文在对 ＴｉＮ、ＴｉＣ陶瓷薄膜与金属 Ａｇ、 Ｃｕ、 Ｎｉ、 Ｆｅ间的浸润性测量的基础上，用扫描电子显微镜（ＳＥＭ）、电子探针（ＥＰＭＡ）对其界面进行了观察。结果表明：浸润性较差的Ａｇ、Ｃｕ与ＴｉＮ、ＴｉＣ的界面平整，几乎没有发生相互扩散和化学反应；而浸润性较好的 Ｆｅ、Ｎｉ与 ＴｉＮ、ＴｉＣ的界面有明显的扩散和化学反应现象沿着ＴｉＮ、ＴｉＣ的晶界扩散；薄膜部分甚至全部溶入金属中。ＴｉＣ薄膜与Ｆｅ的界面反应程度大于ＴｉＮ 薄膜。
Based on the measurement of the wettability of TiN, TiC ceramic thin films and Ag, Cu, Ni and Fe metals, the interface of the films was observed by scanning electron microscopy (SEM) and electron probe (EPMA). The results show that the interface between Ag, Cu and TiN and TiC with poor infiltration is flat and there is almost no interdiffusion and chemical reaction. However, the interface between Fe and Ni with TiN and TiC has obvious diffusion and chemical reaction The phenomenon spreads along the grain boundaries of TiN and TiC; some or all of the film dissolves into the metal. The interfacial reaction between TiC film and Fe is greater than TiN film.