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经中国半导体行业协会(以下简称“中半协”)决定,半导体分立器件分会将于2016年7月26—29日召开《2016’全国半导体器件产业发展、创新产品和新技术研讨会》。届时,工信部电子信息司、中半协及国家集成电路产业投资基金公司等领导、专家将亲临指导。会议组织国内著名专家的特邀报告、专题报告以及企业形象和产品展览活动,欢迎广大从事半导体器件研究、开发和生产的科研人员、工程技术人员和管理人员积极参与交流和撰写论文,展示最新研究进展以及
The China Semiconductor Industry Association (hereinafter referred to as “CASE”) decided that the semiconductor discrete devices branch will be held on July 26-29, 2016, “2016 ’National Semiconductor Device Industry Development, Innovative Products and New Technology Symposium” . By then, the Ministry of Industry and Information Electronics Division, the semi-aisle and the National IC Industry Investment Fund companies and other leaders and experts will visit the guide. The meeting organized the invited domestic famous experts report, special reports and corporate image and product exhibition activities, welcomed the broad engaged in research, development and production of semiconductor devices, engineers, engineers and managers to actively participate in the exchange and writing papers to showcase the latest research Progress as well