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本刊获悉,哈尔滨工业大学申请建立“电子封装技术”专业已经获得主管部门的批准,自此哈工大在本科层次开始系统性地培养微电子封装制造技术的专门人才。目前专业培养方案和教学计划已经
This magazine was informed that Harbin Institute of Technology to apply for the establishment of “electronic packaging technology” has been approved by the competent authorities, since the HIT undergraduate level systematic training of microelectronics package manufacturing technology expertise. The current professional training programs and teaching plans have been