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印度加尔各答电化学中心研究所的SJayakrishnan等人研究了低浓度镍镀液,其目的在于开发适合低温下工作的光亮剂体系,并保持常规光亮镀镍的优良性能。从含有不同镍盐、硼酸及氯化物浓度镀液的研究结果得知,氯化物含量较高时虽可扩大电流密度范围。但增加了镀层的内应力;若增加镀液中硼酸含量,可提高电流密度上限,减少镀焦面积。确定低浓度镍镀液的组成为:
SJayakrishnan et al., Institute of Electrochemistry, Calcutta, India, studied low-concentration nickel plating baths with the aim of developing brightener systems suitable for operation at low temperatures and maintaining the excellent properties of conventional bright nickel plating. From different nickel salts, boric acid and chloride concentrations of the plating solution of the study found that although the higher chloride content can expand the current density range. However, the internal stress of the coating is increased; if the content of boric acid in the plating solution is increased, the upper limit of the current density can be increased and the plating area can be reduced. Make sure the composition of low concentration nickel plating solution is: