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以硅烷偶联剂(KH-550)改性的微细Cu(铜)粉为导电填料、环氧树脂(EP)为基体树脂、乙二胺为固化剂和无水乙醇为溶剂,制备了改性Cu粉/EP导电胶。研究结果表明:不同Cu粉掺量不会改变Cu粉/EP导电胶的基本结构;纯EP导电胶和改性Cu粉/EP导电胶的表面均比较光滑(无气泡),并且结构规整、固化良好;改性Cu粉/EP导电胶的电导率随Cu粉掺量增加而增大,导电性能增强;当w(KH-550改性Cu粉)=50%(相对于EP质量而言)时,改性Cu粉/EP导电胶的导电性能良好。
The Cu (copper) powder modified by the silane coupling agent (KH-550) was used as the conductive filler, the epoxy resin (EP) as the matrix resin, the ethylenediamine as the curing agent and the anhydrous ethanol as the solvent, Cu powder / EP conductive plastic. The results show that: the different Cu powder content will not change the basic structure of Cu powder / EP conductive adhesive; Pure EP conductive adhesive and modified Cu powder / EP conductive adhesive surface are relatively smooth (no bubbles), and the structure of regular, solidified The conductivity of modified Cu powder / EP conductive paste increased with the increase of Cu powder content, and the conductivity increased; when w (KH-550 modified Cu powder) = 50% (relative to the mass of EP) , Modified Cu powder / EP conductive plastic conductivity good.