利用真空蒸镀的氧化锌薄膜进行绝缘体表面金属化

来源 :自然科学进展 | 被引量 : 0次 | 上传用户:nizhongyu
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
利用真空蒸镀法在光滑的玻璃表面直接制备一层ZnO多晶薄膜,与喷射热分解法制备的ZnO薄膜相比,允许的线宽更窄更细。经Pd溶液活化后,继续浸入化学镀铜液中,在Pd~(2+)的催化作用下,玻璃表面沉积出一层光亮的铜膜。表明使用该方法易于获取附着牢固、颗粒细小和导电性好的金属铜层,有望用于印刷电路板的高密度配线。 The ZnO polycrystalline thin film is directly prepared on the smooth glass surface by the vacuum evaporation method. Compared with the ZnO thin film prepared by the jet pyrolysis method, the allowable line width is narrower and thinner. After activation by Pd solution, immersion continues in the electroless copper plating solution. Under the catalysis of Pd ~ (2+), a layer of bright copper film is deposited on the glass surface. It shows that this method is easy to obtain the metal copper layer with firm adhesion, small size and good electrical conductivity, which is expected to be used in high density wiring of printed circuit boards.
其他文献