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采用三种带有氰基的苯并噁嗪(Ben)与环氧树脂(E51)共混,制备了Ben/E51共混体系。用红外光谱研究了Ben/E51共混体系的固化行为。利用TGA和DMA研究了Ben/E51固化物的耐热性能和动态力学性能,结果显示,共聚体系的分解温度与用酸酐或胺固化的环氧树脂相比提高了70~80℃,玻璃化转变温度提高了30~70℃。Ben/E51共混体系的力学性能和介电性能比苯并噁嗪树脂有明显提高。
Ben / E51 blends were prepared by blending three kinds of Benzooxazines with Benzo (Ben) with epoxy (E51). The curing behavior of Ben / E51 blends was studied by infrared spectroscopy. The heat resistance and dynamic mechanical properties of Ben / E51 cured material were studied by TGA and DMA. The results showed that the decomposition temperature of copolymer was 70 ~ 80 ℃ higher than that of acid anhydride or amine cured epoxy resin. The glass transition temperature Temperature increased by 30 ~ 70 ℃. The mechanical properties and dielectric properties of Ben / E51 blends were significantly higher than those of benzoxazine resins.