利用X射线拉伸实验研究了具有二维残余应力的Cu附着膜的屈服强度与退火温度的关系.结果表明, Cu附着膜的条件屈服点随着退火温度的增高而减小,退火温度在150-300℃间变化时,减小幅度最大,出现明显的拐点.这主要由于Cu附着膜在该温度范围内发生了再结晶,使得原有的大部分组织结构强化因素消失了. Cu附着膜的屈服强度远远高于块体Cu材的屈服强度. The relationship between the yield strength and annealing temperature of Cu films with two-dimensional residual stress was studied by X-ray tensile test.The results show that the yield point of Cu films decreases with the increase of annealing temperature, and the annealing temperature is about 150 -300 ℃, the biggest decrease appeared, and a significant inflection point appeared, which was mainly due to the recrystallization of Cu film in the temperature range, which made most of the existing structural strengthening factor disappear. The yield strength is much higher than the yield strength of bulk Cu material.