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本文介绍了SPC技术在半导体硅外延工艺生产中的应用。统计过程控制(SPC:Statistical Process Control)技术是以数理统计为基础,对生产过程的关键工艺参数进行定量分析,得出工艺过程是否处于受控状态的结论。在硅外延工艺中通过SPC技术监控和调整工艺参数,预防了设备条件和环境条件波动造成的质量损失,同时很大程度上提升了产品的一致性和稳定性。
This article describes the SPC technology in the production of semiconductor silicon epitaxial process applications. Statistical Process Control (SPC) technology is based on mathematical statistics as the basis for quantitative analysis of the key process parameters of the production process to draw conclusions as to whether the process is under control. Monitoring and adjusting process parameters through SPC technology in the silicon epitaxial process prevents the quality loss caused by the fluctuation of equipment conditions and environmental conditions and at the same time greatly improves the consistency and stability of the product.