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通过X射线光电子能谱(XPS)、扫描电子显微镜(SEM)和电化学实验等手段,研究了含铜铁素体抗菌不锈钢表面上的富铜析出相在杀菌过程中的作用机制。研究结果表明,富铜相均匀弥散地分布在抗菌不锈钢的表面上;抗菌不锈钢在与大肠杆菌接触后,富铜相中的铜以Cu2+形式溶出并与细菌作用,导致细菌死亡;由于表面富铜相中铜离子的溶出,抗菌不锈钢表现出耐点蚀电位的下降。
The mechanism of bactericidal action of copper-rich precipitates on the surface of copper-containing ferrite antibacterial stainless steel was studied by means of X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and electrochemical experiments. The results show that the copper-rich phase is uniformly dispersed on the surface of the antibacterial stainless steel. After the antibacterial stainless steel comes into contact with Escherichia coli, copper in the copper-rich phase dissolves in the form of Cu2 + and acts on the bacteria, resulting in the death of the bacteria. Phase dissolution of copper ions, antibacterial stainless steel showed pitting resistance potential decline.