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本文给出了通过测试器件热阻来描绘其安全工作区的方法,采用该方法确定的安全工作区的二次击穿限比用二次击穿测试仪测得的要低,但能避免器件的损伤和永久性损坏,确定出的安全工作区是安全的.
This article presents a method to characterize the safe operating area by testing the thermal resistance of the device. The secondary operating limit of the safe operating area, as determined by this method, is lower than that measured by the secondary breakdown tester, Damage and permanent damage identified safe working area is safe.