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文章从印制电路板制造商和组装商的角度,搜集了浸银工艺可能存在的各种缺陷,给出了他们各自对这些缺陷的不同认识;同时,分析了这些缺陷产生的可能原因,提出了消除或降低这些缺陷的有效方法。
From the perspective of PCB manufacturers and assemblers, the article collected all possible defects of immersion silver process and gave their own different understanding of these defects. At the same time, the possible causes of these defects were analyzed and put forward An effective way to eliminate or reduce these shortcomings.