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在国际上，计算机学者在讨论下一代的处理机体系结构和未来的计算机技术。因为微电子工艺的迅速发展，已有可能在一个芯片上集成１０亿个晶体管。这样的极高的集成度（ＥＬＳＩ），为计算机体系结构设计者开辟了一个宽广的技术领域和思想空间，容许我们设计出崭新的处理机和计算机芯片。本文综述了目前美国认为有前途的四种所谓ＢｉｌｉｏｎＴｒａｎｓｉｓｔｏｒｓｏｎＣｈｉｐ的体系结构：即单个功能很强的处理机（Ｕ－ＮＩＰＲＯＣ），并发的多线程处理机（ＳＭＴ），片上多处理机系统（ＣＭＰ），和智能随机存储器（ＩＲＡＭ）。这四种体系结构，将充分利用片上指令级并行性ＩＬＰ和线程级的并行性，或充分利用片上数据交换的极高频宽，或充分利用ＣＰＵ和存储器之间的高速频带总线。而这种１０亿晶体管的芯片，可使单片的峰值速度达到１６０亿次／秒。这对未来的计算机技术会带来极其深刻的影响。在这种芯片设计中，体系结构设计者还要十分注意微电子工艺在极高集成度中的一些特殊问题。
Internationally, computer scientists are discussing the next generation of processor architectures and future computer technologies. Because of the rapid growth of microelectronics processes, it is already possible to integrate 1 billion transistors on a single chip. This very high level of integration (ELSI) opens up a broad technological area and conceptual space for computer architecture designers, allowing us to design new processors and computer chips. This article reviews four so-called BilionTransistorsonChip architectures that the United States considers promising: a single, highly functional processor (U-NIPROC), concurrent multithreaded processor (SMT), multiprocessor system on chip (CMP) And intelligent random access memory (IRAM). These four architectures will take full advantage of ILP and thread-level parallelism on on-chip instruction level parallelism or take full advantage of the extremely high bandwidth of on-chip data exchange or take full advantage of the high-speed band bus between CPU and memory. This 1 billion transistor chip, monolithic peak speed of 16 billion times / sec. This will have a profound impact on the future of computer technology. In this type of chip design, architects are also paying special attention to some of the special issues that microelectronic processes have in extreme integration.