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在Gleeble-1500D热模拟试验机上,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.15Ag合金在高温压缩变形中的流变应力行为和组织变化进行了研究。结果表明,应变速率和变形温度变化对合金的流变应力影响较大,变形温度越高,应变速率越小,合金的流变应力越低,即合金越容易发生动态再结晶;合金的显微组织随变形温度的升高先部分细化,随后细化区域扩大,最后晶粒长大并均匀化;求得Cu-2.0Ni-0.5Si-0.15Ag合金的热变形激活能Q为312.3kJ/mol,Z参数的对数和峰值应力较好地满足线性关系,建立了Cu-2.0Ni-0.5Si-0.15Ag合金的流变应力方程。
The flow stress behavior and microstructure change of Cu-2.0Ni-0.5Si-0.15Ag alloy during high-temperature compression deformation were studied on Gleeble-1500D thermal simulator by high temperature isothermal compression test. The results show that the strain rate and deformation temperature have a great influence on the flow stress of the alloy. The higher the deformation temperature is, the smaller the strain rate is. The lower the flow stress of the alloy is, the more easily the alloy recrystallizes. The microstructure of the alloy The microstructure of the Cu-2.0Ni-0.5Si-0.15Ag alloy was characterized by partial refinement with the increase of the deformation temperature, and then the refinement area was enlarged and finally the grains grew up and homogenized. The thermal deformation activation energy Q of the Cu-2.0Ni-0.5Si-0.15Ag alloy was 312.3kJ / mol, the logarithm and peak stress of Z parameter satisfied the linear relationship, and established the flow stress equation of Cu-2.0Ni-0.5Si-0.15Ag alloy.