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八十年代以来,电子设备朝着小型化、轻量化、多功能、高可靠性方向发展,大规模集成电路,超大规模集成电路高密度地安装在印制板上,散热便成为一大难题。而常用的印制板是采用增强的环氧或酚醛树脂绝缘的基材与铜箔一起压制的覆铜箔板,人们不得不寻求新的基材来制作印制板。近年来由于金属基芯印制板具有好的散热性、尺寸稳定性、耐热性和耐燃性、良好的磁屏蔽性和电磁特性(铁芯印制板),以及可以制成挠性金属基芯
Since the 1980s, the development of miniaturization, lightweight, multi-purpose and high reliability of electronic devices has led to the heat dissipation of large-scale integrated circuits and very large-scale integrated circuits mounted on printed boards. The commonly used PCB is the use of enhanced epoxy or phenolic resin insulation substrate and copper foil together to suppress the copper clad laminate, people have to find a new substrate to make PCB. In recent years, the metal base printed circuit board has good heat dissipation, dimensional stability, heat resistance and flame resistance, good magnetic shielding and electromagnetic properties (core PCB), and can be made of flexible metal base core