低成本、高性能的塑料封装是飞思卡尔功率产品的核心竞争力之一。一般考虑到热效应等因素,塑料封装普遍用于MCU等低功率器件,而用于基站的PA产品通常使用陶瓷封装。飞思卡尔的先进技术即发挥了塑料封装的低成本优势,又确保与陶瓷封装相当的性能;此外,无需热补偿电路。 Low-cost, high-performance plastic packages are one of Freescale’s core competencies for power products. Generally considering the thermal effects and other factors, plastic packages are generally used for MCUs and other low-power devices, and PA products for base stations usually use ceramic packages. Freescale’s state-of-the-art technology takes advantage of the low cost of plastic packaging and ensures comparable performance to ceramic packages; in addition, no thermal compensation circuitry is required.