Maximum bubble pressure measurement was employed to evaluate surface tension of Sn-8Zn-3Bi(0-0.15)Nd and Sn-8Zn-3Bi-(0- 0. 15)La solder melts. Wetting balance m
The joining of graphite, ceramic SiC and Cf/SiC composites via preceramic silicone resin(SR) at high temperature (800-1400℃) was studied. The curing and pyroly
Electrochemical behaviors of Ti-Ni shape memory alloy in fibrinogen solution were studied by electrochemical techniques. The results indicate that the addition
Effects of matrix properties on the actuation characteristics of embedded shape memory alloy wires were studied. The coefficient of thermal expansion and the mo