The currently used ceramic nozzles for aluminum deep processing continuous hot rolled strips are featured with good integrity,high strength,good processing property,but non-uniform structure caused by the migration of silica sol. In this work,nozzle materials were prepared with aluminum silicate ceramic fiber,kaolin,and aluminum tripolyphosphate as starting materials,silica sol or silica sol- epoxy resin as the binder. After pulping,casting,curing at different temperatures and hot treatment,the prepared materials were analyzed in terms of migration layer thickness,cold modulus of rupture,and microstructure morphology. The results show that( 1) with the same curing temperature,the migration layer thickness of specimens bonded by different binders all decreases with the curing time prolonging; with the same curing time,the migration thickness declines first and climbs then as the curing temperature increases; overall,the specimen cured at 40 ℃ for 120 min has the thinnest migration layer; from the comparison,it is found that the silica sol- epoxy resin bonded specimen has slightly thinner migration layer than the specimen bonded by silica sol only;( 2) the specimen bonded by silica sol and epoxy resin has thinner migration layer,lower cold modulus of rupture and obvious lower bulk density than the silica sol bonded specimen;( 3) the material introduced with epoxy resin has better processing property but slightly lower strength than the material bonded by silica sol. The currently used ceramic nozzles for aluminum deep processing continuous hot rolled strips are featured with good integrity, high strength, good processing property, but non-uniform structure caused by the migration of silica sol. In this work, nozzle materials were prepared with aluminum silicate ceramic fiber, kaolin, and aluminum tripolyphosphate as starting materials, silica sol or silica sol-epoxy resin as the binder. After pulping, casting, curing at different temperatures and hot treatment, the prepared materials were analyzed in terms of migration layer thickness, cold modulus of rupture, and microstructure morphology. The results show that (1) with the same curing temperature, the migration layer thickness of several bonded bonded by different binders all decreases with the curing time prolonging; with the same curing time, the migration thickness declines first and climbs then as the curing temperature increases; overall, the specimen cured at 40 ° C for 120 min has the thinnest migration lay er; from the comparison, it is found that the silica sol-epoxy resin bonded specimen has a slightly thinner migration layer than the specimen bonded by silica sol only; (2) the specimen bonded by silica sol and epoxy resin has thinner migration layer, lower cold modulus of rupture and significantly lower bulk density than the silica sol bonded bonded; (3) the material introduced with epoxy resin has better processing property but slightly lower strength than the material bonded by silica sol.