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面对着国际芯片工业这样日新月异的高速发展,面对着芯片设计,芯片制造,半导体设备材料和3D先进封装技术的不断创新,面对着加剧形成的超垄断状况,我国的半导体芯片产业,一定要在远远落后的情况下,在“不对称竞争”的情况下,各地各公司努力在极其分散的情况下,认清差距,拨正方向,以正确的策略,急起直追。
Faced with such rapid development of the international chip industry such rapid development, the face of chip design, chip manufacturing, semiconductor equipment and advanced packaging technology, continuous innovation, in the face of aggravate the formation of ultra-monopoly, China’s semiconductor chip industry, must Under the situation of far behind and under the condition of “asymmetric competition,” all localities and enterprises will strive to catch up with the gaps and establish a correct direction in the extremely dispersed situation.