1991年8月19日在天津大学召开了《电镀与精饰》第三届编委会。来自北京、上海、哈尔滨、南京及天津等地的部分编委20余人,出席了此次的盛会,因公或因故未能出席的编委都亲自来信来函说明情况,并对今后工作提出宝贵意见,寄语我们的期刊越办越好,希望将本次会议精神传达给他们,如北京陈仲伟高级工程师,胡志彬教授,天津的梁时骏高级工程师等都分別寄语编委会,表现出对编委工作极端的热忱和责任心。 August 19, 1991 in Tianjin University held a “electroplating and fine decoration,” the third editorial board. More than 20 editorial board members from Beijing, Shanghai, Harbin, Nanjing and Tianjin attended the gala and wrote a letter from the editorial board member, either public or for any reason, explaining the situation and putting forward valuable work in the future Opinions and Messages Our journals are getting better and better. We hope to convey to them the spirit of the conference. For example, senior engineers of Beijing Chen Zhongwei, Professor Hu Zhibin and Senior Engineer Liang Shijun of Tianjin sent messages to the Editorial Board, The enthusiasm and sense of responsibility.