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采用化学镀法制备具有高银含量、一定厚度、致密性好的银包铜粉,用SEM、XRD、粒度分布仪、数字欧姆表和差热分析仪表征了镀银铜粉和原始铜粉的表面形貌、表面结构及导电性能。结果表明:高银含量银包铜粉表面镀层致密性好、包覆完全,包覆层厚度达到336nm,同时具有较好的导电性和抗氧化性。
Silver plating copper powder with high silver content, certain thickness and compactness was prepared by electroless plating. The properties of silver-coated copper powder and original copper powder were characterized by SEM, XRD, DOP, digital ohmmeter and differential thermal analyzer Surface morphology, surface structure and electrical conductivity. The results show that the surface coating of high silver content waffle copper powder has good compactness and complete coating, the thickness of the coating reaches 336nm, and has good conductivity and oxidation resistance at the same time.