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目前,光器件在硅基衬底上的集成是光电领域的研究热点。将基于表面张力的流体自组装技术应用于薄膜金属-半导体-金属(MSM)光探测器的集成上,其集成效果的优劣与器件绑定点的几何形状有关。为了有效预测薄膜MSM光探测器绑定点的间距和形状对集成效果的影响,利用MATLAB对其集成过程中表面自由能的分布状况进行了仿真分析。首先,在介绍薄膜MSM光探测器的基础上,对其集成过程建立了平移和旋转仿真模型。然后,根据表面自由能与匹配度的线性关系,分别仿真出了不同间距和形状的绑定点在集成过程中匹配度的分布状况图。通过分析匹配度的斜率以及正确装配状态和误装配状态之间的关系,预测两端绑定点间距较长、绑定点形状为梯形时集成效果较好。最后,考虑到薄膜光电器件有可能需要区分正负极的情况,将其两端绑定点设计成不对称形状并进行仿真分析,尽量避免集成过程中出现正负极反接的状态。
At present, the integration of optical devices on silicon substrates is a hot topic in the field of optoelectronics. The surface tension-based fluid self-assembly technology is applied to the integration of thin film metal-semiconductor-metal (MSM) photodetectors. The integration effect is related to the geometry of the bonding point of the device. In order to effectively predict the effect of the spacing and shape of the bonding points of the thin film MSM photodetectors on the integration effect, the distribution of surface free energy in the integration process of the thin film MSM photodetectors was simulated by using MATLAB. First of all, based on the introduction of thin-film MSM photodetector, a translation and rotation simulation model is established for its integration process. Then, according to the linear relationship between the surface free energy and the matching degree, the distribution of the matching degree of the binding points with different pitches and shapes in the integration process is simulated respectively. By analyzing the slope of the matching degree and the relationship between the correct assembly state and the incorrect assembly state, it is predicted that the bonding points at both ends are long and the integration effect is good when the binding point shape is a trapezoid. Finally, taking into account the thin-film optoelectronic devices may need to distinguish between positive and negative situations, the binding points at both ends of the asymmetric shape designed and analyzed, as far as possible to avoid the integration process of positive and negative reverse state.