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本文以硫脲和二甲硫基甲苯二胺(DMTDA)为原料,制备了一种新型环氧树脂固化剂,通过对硫脲反应程度,凝胶程度及其固化物拉伸强度,对合成条件进行了优化,结果表明,硫脲改性DMTDA的最佳工艺条件为DMTDA/硫脲的摩尔比为4:1,于130℃反应7h。改性固化剂较佳固化条件为环氧树脂/固化剂质量比为100/35,该体系经固化后其固化物的拉伸强度可达41.3MPa。
In this paper, thiourea and dimethylthiotoluenediamine (DMTDA) as raw materials to prepare a new type of epoxy resin curing agent, through the degree of thiourea reaction, the extent of the gel and the tensile strength of its cured, the synthesis conditions The results showed that the optimum conditions of DMTDA modified with thiourea were as follows: the molar ratio of DMTDA / thiourea was 4: 1 and reacted at 130 ℃ for 7h. The modified curing agent preferably curing conditions epoxy resin / curing agent mass ratio of 100/35, the cured system after curing the tensile strength of up to 41.3MPa.