为了解决电容极板间隙低至3μm时传感器键合封接后内部活动部件粘连失效的问题,介绍了一种利用去除部分Au层的办法来抑制小间隙键合粘连,通过严控元件表面生产质量,合理地设计伺服控制器,制作的微加速度传感器已经达到了±70g的量程,单边线性二次项系数10-6量级,残差控制在15mg以内,相对精度达到了2×10-4,达到了设计要求。 In order to solve the problem that the internal active components are stuck after the sensor is bonded and sealed, the method to remove the part of the Au layer is used to restrain the small gap bonding and adhesion by strictly controlling the surface quality of the components , The servo controller is designed reasonably. The manufactured micro acceleration sensor has reached the range of ± 70g, the unilateral linear quadratic coefficient is 10-6, the residual error is less than 15mg and the relative accuracy is 2 × 10-4 , Reached the design requirements.