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电子产品中,在一些特殊应用环境中要求耐压密封环境。工程中通常将电子模块置于金属外壳中,敞口处则采用玻璃烧结或灌注环氧胶等方法进行封装。而在实际操作中遇到的主要问题是:由于两种材料热膨胀系数的不同,通常在环氧胶体最薄弱部位出现裂纹,导致密封失效发生泄漏。本文作者运用力学原理以结构受力角度进行理论分析,从而探讨结构尺寸变化与灌注失效之间的关系。
Electronic products, in some special applications require pressure sealed environment. In engineering, the electronic module is usually placed in a metal shell, and the open area is sealed by glass sintering or epoxy glue injection. However, the main problems encountered in practical operation are: due to the difference in thermal expansion coefficient of the two materials, cracks usually occur in the weakest part of the epoxy colloid, resulting in leakage of sealing failure. In this paper, the author uses the principle of mechanics to make a theoretical analysis of the structural stress angle, so as to discuss the relationship between structural dimension change and perfusion failure.