光掩膜的制造是集成电路制造的关键工艺,掩膜的质量是直接影响到集成电路的技术性能和产品的成品率。特别是由于集成电路向着高密度大规模方向发展,对光掩膜提出了更高的要求。因此,它的检测和测量也就成为一个重要课题。对光掩膜的检查内容主要包括下列两个方面:1.绝对尺寸的测量2.对缺陷的测量由于光掩膜的绝对尺寸和影响性能的缺陷的大小,都在微米范围内,因而对它的检查都属于精密计量的范筹。目前已广泛应用掩膜检查测量的方法主要有如下几种: The manufacture of photomasks is a key process in the fabrication of integrated circuits. The quality of the masks has a direct impact on the technical performance of the integrated circuit and the yield of the product. In particular, due to the high density of integrated circuits toward the development of large-scale, the mask set higher requirements. Therefore, its detection and measurement has also become an important issue. Photomask inspection mainly includes the following two aspects: 1. Measurement of absolute size 2. Measurement of defects Due to the absolute size of the mask and the size of the defects that affect the performance, are in the micron range, so it The inspection belongs to the precision measurement of the standard. Currently widely used mask inspection methods are mainly the following: