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A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N~2 subbeams to realize the whole-field inspection.A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision,high speed and simple structure.
A whole-field 3D surface measurement system for semiconductor wafer inspection is described. The system consists of an optical fiber plate, which can split the light beam into N ~ 2 subbeams to realize the whole-field inspection. A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision, high speed and simple structure.