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皇家飞利浦电子公司宣布有3款关键的90n m C M O S产品正式在法国Crolles的Crolles2联盟晶圆生产厂投入大批量生产,其中一款产品每月的发货量已经超过100万片。飞利浦公司的这三款产品是用于高度集成的系统级封装(System-in-Package(SiP))连接解决方案的基带芯片。通过这三款产
Royal Philips Electronics announced the launch of three key 90nm MCOM products in full production at the Crolles2 alliance wafer fabrication facility in Crolles, France, with more than 1m units being shipped per month. The three Philips products are baseband chips for a highly integrated system-in-package (SiP) connectivity solution. Through these three products