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研究了极限评估试验技术,选用国内某款GaAs MMIC功率放大器芯片,分析了器件的详细规范、关键参数、极限判据等信息,设计了高温极限评估试验和电压应力极限评估试验的试验剖面,考察器件在热、电应力下的极限能力和失效模式,并对极限评估试验的技术手段进行了实验验证。实验结果表明,极限评估试验技术能有效评价两组试验器件的各类极限,通过试验可以获得器件的失效模式,以及器件的可靠性裕度,为改进元器件设计、材料和工艺提供依据。
In this paper, the limit evaluation test technique is studied. A certain GaAs MMIC power amplifier chip is selected. The detailed specifications, key parameters and limit criteria of the device are analyzed. The experimental profiles of the high temperature limit evaluation test and the voltage stress limit evaluation test are designed. The ultimate capability and failure mode of the device under thermal and electric stress are tested experimentally with the technical means of limit evaluation test. The experimental results show that the limit evaluation test technique can effectively evaluate the various limits of the two test devices. The failure mode of the device and the margin of reliability of the device can be obtained through experiments, providing the basis for improving component design, materials and processes.