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为获得具有高出光效率、高导热性能的发光二极管(LED)封装基板,采用直接敷铝(Al)工艺制备了铝/氧化铝(Al_2O_3)复合陶瓷基板并对其表面进行化学机械抛光处理。运用光学模拟软件Tracepro和热学模拟软件ANSYS对该陶瓷基板封装的LED光源的光学性能和热学性能进行了模拟计算,并和传统氧化铝陶瓷基板封装的LED光源进行了对比分析,最后将所制备的铝/氧化铝陶瓷基板封装成板上芯片直装(COB)型LED光源进行测试。模拟和实验测试结果均表明:直接敷铝工艺制备的铝/氧化铝陶瓷基板热传递速度更快,导热性能更加优异,更适合用于大功率LED光源的封装;铝/氧化铝陶瓷基板封装的的LED光源比基于传统氧化铝陶瓷基板的LED光源的光通量大,出光效率更高。
In order to obtain a light-emitting diode (LED) package substrate with high light-emitting efficiency and high thermal conductivity, an aluminum / alumina (Al 2 O 3) composite ceramic substrate was prepared by a direct aluminum deposition process and its surface was subjected to chemical mechanical polishing. The optical properties and thermal properties of the LED light source encapsulated in the ceramic substrate were simulated and calculated by using the optical simulation software Tracepro and the thermal simulation software ANSYS. The LED light source encapsulated in the conventional alumina ceramic substrate was compared and analyzed. Finally, Aluminum / alumina ceramic substrates are packaged as chip on board (COB) LED light sources for testing. Simulation and experimental results show that the aluminum / alumina ceramic substrate prepared by the direct aluminum deposition process has faster heat transfer and better thermal conductivity, and is more suitable for packaging high power LED light sources. The aluminum / alumina ceramic substrate package LED light source than the traditional alumina ceramic substrate based on the LED light flux, the light output higher efficiency.