The influence of crystallographic orientation on the void growth in FCC crystals was numerically simulated with 3D crystal plasticity finite element by using a 3D unit cell including a spherical void, and the rate-dependent crystal plasticity theory was implemented as a user material subroutine. The results of the simulations show that crystallographic orientation has significant influence on the growth behavior of the void. Different active slip systems of the regions around the void cause the discontinuity in lattice rotation around the void, and the corner-like region is formed. In the case of the void located at grain boundary, large heterogeneous deformation occurs between the two grains, and the equivalent plastic deformation along grain boundary near the void in the case of θ=45°(θ is the angle between grain boundary direction and X-axis) is larger than the others. Large difference of orientation factor of the two grains leads to large equivalent plastic deformation along grain boundary, and the unit cell is more likely to fail by intergranular fracture.