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孔化板生产中的质量控制因素较多。这里,笔者就其孔化板加工质量控制之一的层间结合,谈一点体会。电镀产品在加工过程中一般不经受结合力工序的冲击(特殊除外)。而孔化板加工过程中几乎每一个加工件都要接受高温冲击(如锡铅合金的热熔),甚至在成品的使用中,也要不断的接受高温冲击(如波峰焊接、手工焊接及三防试验等);电镀成品一旦发现结合力存在问题,可以施行弥补手段,即电镀工艺中常用的退除镀层后再重新电镀。而孔化板在接受高温冲击工艺时,如发现结合力有毛病时已到了无法挽救的地步。为此,应想方设法避免。生产过程中应加以严格控制以保证层间结合。
There are many quality control factors in the production of the perforated plate. Here, the author of its hole plate processing quality control of the combination of one layer, talk about experience. Plating products in the processing of the general process do not withstand the impact of bonding (except for special). The process of processing almost every hole plate to be subjected to high temperature impact (such as tin-lead alloy hot melt), even in the use of finished products, but also continue to accept high temperature impact (such as wave soldering, hand soldering and three Anti-test, etc.); once the finished product found plating problems, you can use to make up for the plating process that is commonly used in the removal of plating before re-plating. The perforated plate in the high-temperature impact of the process, if found defective bonding has reached the point where it can not be saved. To this end, we should find ways to avoid. The production process should be strictly controlled to ensure the integration between layers.