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聚酰亚胺(PI)在空间飞行器中广泛用作多层热绝缘毯、太阳电池阵列的柔性基板以及电路系统的绝缘保护层。但普通型PI在低地球轨道(LEO)原子氧环境中易发生降解。因此,提高PI材料抗原子氧能力的研究近年来受到了广泛的重视。本文概述了这一研究领域内的最新进展情况,重点阐述了含苯基氧化膦(PPO)、含笼型低聚倍半硅氧烷(POSS)以及含锆基PI材料的结构与抗原子氧特性之间的关系。最后结合作者的研究工作对国内抗原子氧PI材料的研究与应用前景进行了展望。
Polyimide (PI) is widely used in spacecraft as a multi-layer thermal insulation blanket, a flexible substrate for solar cell arrays, and an insulating protective layer for circuit systems. However, common PI is prone to be degraded in low LEO atomic oxygen environment. Therefore, the research on improving the ability of PI material to resist the proton oxygen has been paid more and more attention in recent years. This article provides an overview of recent developments in this area of research, highlighting the structure of the phenylphosphine oxide-containing (PPO), cage-containing oligomeric silsesquioxanes (POSS) and zirconium-containing PI materials, Relationship between characteristics. Finally, combined with the author’s research work on the domestic anti-oxygen material PI research and application prospects are prospected.