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目的对焊锡作业的工作场所铅浓度和焊锡作业工人血铅浓度进行调查,了解焊锡作业铅污染的情况。方法空气铅浓度采用火焰原子吸收法测定,血铅浓度采用石墨炉原子吸收光谱法测定。结果焊锡作业岗位与对照组空气中检出铅含量岗位数差异无统计学意义(χ2=1.235,P=0.266);但焊锡作业空气中铅检出点铅烟浓度高于对照组,差异有统计学意义(t=2.206,P=0.027)。在焊锡岗位工人血铅含量与对照组工人之间差异无统计学意义(t=0.932,P=0.324)。结论统计结果显示没有明显证据表明深圳电子行业焊锡作业存在铅污染。
Objective To investigate the workplace lead concentration in solder work and the blood lead concentration in workers exposed to solder work to understand the lead pollution in solder work. Methods The concentration of lead in air was determined by flame atomic absorption spectrometry. The concentration of lead in blood was determined by graphite furnace atomic absorption spectrometry. Results There was no significant difference in the number of posts detected in the air between the soldering station and the control group (χ2 = 1.235, P = 0.266). However, the concentrations of lead in the air of the soldering station were higher than those of the control group Significance (t = 2.206, P = 0.027). There was no significant difference in blood lead level among workers in the solder post and workers in the control group (t = 0.932, P = 0.324). Conclusions The statistical results show that there is no clear evidence of lead pollution in the soldering operation in Shenzhen’s electronics industry.