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多层铜箔迭层板TLM-551是采用与双面通孔印制电路板相同的工艺过程,能制成多层印刷电路板内层电路的铜箔迭层板。质量好、可靠性高,交付期短、经济,其特点如下: (1)是美国全国标准协会(ANSI)等级(相当于日本工业标准GE4F)的产品,满足日本工业标准C6484。此外,符合UL—796CCIL的要求。 (2)耐湿性、耐热性好。 (3)能制成尺寸精度高的印刷电路板。 (4)钻孔加工性好。
Multi-layer copper foil laminate TLM-551 is the same process with double-sided through-hole printed circuit board, can be made of multilayer printed circuit board copper foil laminates. Good quality, high reliability, short lead time, economy, and its features are as follows: (1) is the American National Standards Institute (ANSI) grade (equivalent to the Japanese industry standard GE4F) products to meet the Japanese industry standard C6484. In addition, the requirements of UL-796CCIL are met. (2) Moisture resistance, heat resistance and good. (3) can be made of high precision printed circuit board. (4) good drilling processability.